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Title:
POLYIMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0641424
Kind Code:
A
Abstract:

PURPOSE: To obtain the polyimide resin composition which can be thermally treated at a low temp. in a short time and is excellent in dimensional stability, flowability, etc., by blending a given polyimide with a polyetheretherketone to cause the resulting composition to have a specific value of crystallization enthalpy after heat treatment.

CONSTITUTION: The composition comprises 50-95 pts.wt. polyimide resin having a repeating unit represented by the formula (wherein X is a direct bond, a 1-10C divalent hydrocarbon group, hexafluoroisopropylidene, carbonyl, thio, sulfonyl, or oxo; Y1 to Y4 each is H, a 1-9C alkyl, a 1-9C alkoxy, Cl, or Br; and R1 is a 2-27C tetravalent group selected from among a (monocyclic) aliphatic group, a monocyclic aromatic group; a fused aromatic group, and a nonfused polycyclic aromatic group consisting of aromatic groups bonded together directly or through a crosslinking member) and 50-5 pts.wt. polyetheretherketone. It has a crystallization enthalpy of 0-6cal/g after heating at 250-330°C (as measured with a differential scanning calorimeter at a heating rate of 10°C/min).


Inventors:
KOBA TOMOHITO
MORITA ATSUSHI
TAKAHASHI TOSHIAKI
ITOU KAYAKO
SHIMAMURA KATSUICHI
OCHI HIROYASU
TOMIMOTO HIROAKI
TAKIZAWA NOBUHIRO
GOTO YOSHIHISA
Application Number:
JP9607793A
Publication Date:
February 15, 1994
Filing Date:
April 22, 1993
Export Citation:
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Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
C08K7/02; C08L71/08; C08L71/10; C08L79/08; (IPC1-7): C08L79/08; C08K7/02; C08L71/10
Attorney, Agent or Firm:
Wakabayashi Tadashi