Title:
TAB TYPE SEMICONDUCTOR DEVICE AND METHOD FOR CONNECTING TAB TYPE SEMICONDUCTOR DEVICE WITH CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2590761
Kind Code:
B2
Abstract:
PURPOSE: To obtain a TAB type semiconductor device, and a method for connecting it with a circuit board, in which alignment between a bonding part of a TAB lead and a bonding pad on a circuit board can be recognized through a simplified supporting member before they are connected by bonding.
CONSTITUTION: A supporting member 20 comprises a central part 21, a peripheral part 26, and an opening 22 wherein the peripheral part 26 comprises a bent side wall part 24 and a flange part 23. The supporting member is bonded, in the central part 21 thereof, with a semiconductor chip 10 through an adhesive material 41. The opening 22 is located above a bonding part 13 and the supporting member is bonded, at the flange part 23 thereof, to a circuit board 30 through an adhesive material 42.
Inventors:
YOSHIDA JUICHI
Application Number:
JP28773894A
Publication Date:
March 12, 1997
Filing Date:
November 22, 1994
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/60; H01L21/00; H01L21/607; H05K3/30; H05K3/34; (IPC1-7): H01L21/60
Domestic Patent References:
| JP4225263A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)