Title:
【発明の名称】LED表示装置の製造方法
Document Type and Number:
Japanese Patent JP3068176
Kind Code:
B2
Abstract:
PURPOSE:To enable component cost and assembly cost to be reduced and weight to be reduced by sealing an LED chip on a specified location on metallized ITO film, Ni.P film, and Au film. CONSTITUTION:A transparent conductive film ITOA is formed on a specified glass substrate B by sputter deposition or vacuum deposition, an ITO film A is patterned to a specified pattern, Ni.P film D is formed on the film A only, and an upper layer of the Ni.P film is replaced by an Au film C. An LED chip F is fixed on a specified location on metallized ITO film A, Ni.P film D, and Au film C, an upper-layer Au film E is formed at a part where an Au wire G is bonded, and the LED pad and the upper-layer Au film E are bonded by the Au wire G. Therefore, since the Ni.P and Au films themselves have a function of a current-limiting resistor of LED, the need for a resistor is eliminated, thus enabling component cost, assembly cost, and weight to be reduced.
Inventors:
Kotaro Yoneda
Toshihiko Tsuboi
Toshihiko Tsuboi
Application Number:
JP33456490A
Publication Date:
July 24, 2000
Filing Date:
November 29, 1990
Export Citation:
Assignee:
Stanley Electric Co., Ltd.
International Classes:
H01L33/56; H01L33/62; (IPC1-7): H01L33/00
Domestic Patent References:
| JP210395A | ||||
| JP6278888A | ||||
| JP49109897A | ||||
| JP3128958A | ||||
| JP3290982A |
Attorney, Agent or Firm:
Teruo Akimoto