HOUSING PACKAGE FOR SURFACE MOUNT ELECTRONIC PART

Title:

HOUSING PACKAGE FOR SURFACE MOUNT ELECTRONIC PART

Document Type and Number:

Japanese Patent JPH0613479

Kind Code:

A

Abstract:

PURPOSE: To readily remove left solder flux, etc., by cleaning after an electronic part to be packaged inside is electrically connected to an external electric circuit accurately and firmly and also mounted on an external electric circuit board.

CONSTITUTION: A surface mount electronic part package comprises an insulating base 1 having a plurality of wiring layers 5 introduced from the upper surface to the lower surface and a cap body 2, and has a space for housing an electronic part 4 inside. A projecting member 9 having a height of 0.05 to 0.3mm is fitted onto the lower surface of the insulating base 1 in a region formed by connecting respectively wiring layers 5 led out to its lower surface to each other.

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Inventors:

KUWATA YOSHIMICHI
HORII MASATSUGU

Application Number:

JP17044292A

Publication Date:

January 21, 1994

Filing Date:

June 29, 1992

Export Citation:

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Assignee:

KYOCERA CORP

International Classes:

H01L23/02; H01L23/12; H01L23/50; H05K3/30; H05K3/34; (IPC1-7): H01L23/02; H01L23/12; H01L23/50

Next Patent: SEMICONDUCTOR ELEMENT HOUSING PACKAGE