Title:
POLYIMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3034143
Kind Code:
B2
Abstract:
PURPOSE: To obtain a composition, capable of remarkably improving the melt fluidity of a resin without impairing characteristics of a polyimide and excellent in molding processability by blending a polyimide resin having a specific structure with an aromatic polyimide oligomer.
CONSTITUTION: The composition is obtained by blending (A) 100 pts.wt. polyimide resin composed of a unit expressed by formula I (X is 1-10C bivalent hydrocarbon, thio, etc.; Y1 to Y4 are H, lower alkyl, etc.; R is ≥2C tetravalent group such as aliphatic or aromatic group) with (B) 0.5-100 pts.wt. aromatic polyimide oligomer. The component (A) is preferably obtained by reacting an ether diamine expressed by formula II such as bis[4-(3-aminophenoxy)phenyl]methane with a tetracarboxylic dianhydride expressed by formula III such as pyromellitic dianhydride and cyclodehydrating the resultant polyamic acid. An aromatic polyimide oligomer composed of a unit expressed by formula I is preferably used as the component (B).
Inventors:
Osamu Yasui
Masahiro Ohta
Masahiro Ohta
Application Number:
JP34254892A
Publication Date:
April 17, 2000
Filing Date:
December 22, 1992
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08K5/3415; C08L79/08; (IPC1-7): C08L79/08; C08K5/3415
Domestic Patent References:
| JP4363360A | ||||
| JP4270763A | ||||
| JP1240565A |