SEMICONDUCTOR LASER PACKAGE - NIPPON TELEGRAPH & TELEPHONE

Title:

SEMICONDUCTOR LASER PACKAGE

Document Type and Number:

Japanese Patent JPH0722710

Kind Code:

A

Abstract:

PURPOSE: To provide a package with a compact appearance while maintaining a forced cooling function for improving the life of semiconductor laser with a high output or multiple beams.

CONSTITUTION: The cooling surface or a Peltier element 8 is joined to the semiconductor laser mounting surface of a semiconductor laser 1 with solder, the semiconductor laser is joined to the heat-absorption surface of the Peltier element via a heat sink 14 and a submount 15, and then the semiconductor laser mounting part and a fin 9 for air-cooling are formed in one piece with a material of improved heat conductivity.

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Inventors:

NAKADA HIROSHI
MURATA SETSUKO
WATABE AKINORI

Application Number:

JP16440593A

Publication Date:

January 24, 1995

Filing Date:

July 02, 1993

Export Citation:

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Assignee:

NIPPON TELEGRAPH & TELEPHONE

International Classes:

H01L23/38; H01L23/467; H01S5/00; (IPC1-7): H01S3/18; H01L23/38; H01L23/467

Attorney, Agent or Firm:

Takashi Sawai

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