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Title:
NEW POLYIMIDE PRECURSOR AND UTILIZATION OF THE SAME
Document Type and Number:
Japanese Patent JP2006342310
Kind Code:
A
Abstract:

To provide a polyimide precursor imidizing at ≤200°C, usable as substrates for rigid and flexible printed circuits and to provide a photosensitive resin composition using the same.

The invention relates to the polyimide precursor comprising an imide structure having a side chain of carbon-carbon double bond as a connecting group between imide groups, having already formed ring structure and a polyamic acid structure originating from a silicone diamine and relates to the photosensitive resin composition comprising the same and a (meth)acrylic compound having a carbon-carbon double bond and a photo reaction initiator.


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Inventors:
OKADA YOSHIFUMI
YAMANAKA TOSHIO
KOJIMA KOHEI
NOJIRI HITOSHI
Application Number:
JP2005171648A
Publication Date:
December 21, 2006
Filing Date:
June 10, 2005
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
C08G73/10; G03F7/027; H05K3/28
Domestic Patent References:
JPH11241022A1999-09-07
JPH09316200A1997-12-09
JPH03157427A1991-07-05
JP2002356555A2002-12-13
JPH11241022A1999-09-07
JPH09316200A1997-12-09
JPH03157427A1991-07-05
JP2002356555A2002-12-13
Foreign References:
WO2002097532A12002-12-05
WO2002097532A12002-12-05



 
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