To provide a polyimide resin soluble in a low-boiling solvent and excellent in heat resistance, chemical resistance, a dimensional stability, low coloration and compatibility with other resins, and a composition obtained using the same.

The polyimide resin comprises is essential ingredients both components of (1) an 8C or higher aliphatic and/or alicyclic component and (2) a diamine or diisocyanate component bearing a biphenyl skeleton or a naphthalene skeleton and is soluble in a solvent containing at least 30 wt.%, based on the total amount of the solvents, of low-boiling solvents. The resin composition comprises the resin. The resin is excellent in electrical characteristics, flame retardancy, dynamic characteristics, dimensional change due to moisture absorption and the like as well as in characteristics mentioned above.