To absorb the external stress propagation, while reducing the frequency fluctuation by external mechanical stress and the manufacturing steps by composing the material of inner electrode part of a soft metal, and setting the level thereof at least a specific value.

In the airtight sealing package, an inner electrode 65 is provided in a package substrate 61 composed of a ceramic and/or glass ceramic. The inner electrode 65 is connected to an outer electrode 66 provided on the bottom of a package substrate 61 through the intermediary of a conductive line 67. Besides, the inner electrode 65 is formed of a projecting soft metal of the height of at least 30μm. Through these procedures, a space can be given to the bottom of a piezoelectric element, thereby enabling the inner electrode 65 to be directly formed on the lower layer glass ceramic 61 besides, the external stress propagation to be absorbed to reduce the distortion in a chrystalline element. Furthermore, a sheetlike holding support can be eliminated thereby reducing the parts and steps.