Title:
パッケージ基板の加工方法
Document Type and Number:
Japanese Patent JP7242377
Kind Code:
B2
Abstract:
To provide a package substrate processing method capable of sufficiently removing burrs from a cut portion of a connection electrode.SOLUTION: The package substrate processing method includes: a connection electrode bisector step of cutting a center of a connection electrode 14 with a cutting blade 36 to form a cut groove 100 from an electrode substrate side 10A of a package substrate 10; a cutting debris removal step of injecting high-pressure water to remove cutting debris from the cut groove; a protective member disposing step of disposing a protective member T on the electrode substrate side; and a division step of positioning the cutting blade at a position corresponding to the cut groove formed on the electrode substrate side from a mold resin side 10b and dividing into package chips 26.SELECTED DRAWING: Figure 7
Inventors:
Chigo Yamada
Application Number:
JP2019062293A
Publication Date:
March 20, 2023
Filing Date:
March 28, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301
Domestic Patent References:
| JP2018186133A | ||||
| JP2015177061A | ||||
| JP2005039088A | ||||
| JP2010225648A |
Attorney, Agent or Firm:
Naozumi Ono
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko