PURPOSE: To readily inspect characteristics of an electronic component without separating a taping by providing a testing hole to which characteristic testing component of the electronic component is inserted at least one of tapes covered in a sandwich state.

CONSTITUTION: A testing hole 8 is formed at the opposed position of a chip type component 1 of a surface covering tape 7 to an electrode 2. A rear surface covering tape 6 is bonded to the rear surface of a cardboard 3, and a bottom of the tape 6 is formed in a punched hole 4, the component 1 is inserted into the hole 4 to bond the bottom to the tape 6, and a surface covering tape 7 is bonded to the front surface of the cardboard 3. When testing the characteristics of the component 1, the characteristic testing component is inserted into the hole 8 to be connected with the electrode 2 of the component 1 to be readily tested.