Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR PARTITION WALL FORMATION, PARTITION WALL STRUCTURE MANUFACTURED USING THE SAME, AND DISPLAY DEVICE INCLUDING THE PARTITION WALL STRUCTURE
Document Type and Number:
Japanese Patent JP2022132185
Kind Code:
A
Abstract:
To provide a photosensitive resin composition for partition wall formation, a partition wall structure manufactured using the same, and a display device including the partition wall structure.SOLUTION: There are provided a photosensitive resin composition for partition wall formation which contains (A) a coloring agent containing a white pigment, (B) a UV absorber, (C) an alkali-soluble resin, (D) a photopolymerizable compound, (E) a photopolymerization initiator, and (F) a solvent, where the UV absorber and the photopolymerization initiator have values of absorbance ratios by a specific expression at a wavelength of 365 nm of 0.3-1.5; a partition wall structure manufactured from the photosensitive resin composition for partition wall formation; and a display device including the same.SELECTED DRAWING: None
Inventors:
KWON MIN-JEONG
KIM HUN-SIK
LEE JAE EUL
KIM HUN-SIK
LEE JAE EUL
Application Number:
JP2022028074A
Publication Date:
September 07, 2022
Filing Date:
February 25, 2022
Export Citation:
Assignee:
DONGWOO FINE CHEM CO LTD
International Classes:
G03F7/004; G02B5/20; G03F7/038; G09F9/30; H01L27/32; H01L51/50; H05B33/12; H05B33/22
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
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