Title:
PASTE COMPOSITION FOR FORMING HEAT-RESISTANT ELECTROCONDUCTIVE PATTERN ON BASE PLATE
Document Type and Number:
Japanese Patent JP2010126725
Kind Code:
A
Abstract:
To provide a paste composition for forming a heat-resistant electroconductive pattern on a base plate by direct printing, a paste composition for forming a solderable electroconductive circuit to produce a flexible printed circuit board (FPCB) and a paste composition for forming a printed antenna conjunctive with RFID (radio frequency identification) tip.
The paste composition includes electroconductive particles, a polyamide acid and a solvent. The polyamide acid is defined by chemical formula 1 wherein R1 and R2 represent a hydrocarbon chain or a heteroatom chain having N, O and/or S, or R1 and R2 represent a crosslink of fusion between benzene rings.
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
PARK SEONG SIL
HEO SOON YEONG
HEO SOON YEONG
Application Number:
JP2009225178A
Publication Date:
June 10, 2010
Filing Date:
September 29, 2009
Export Citation:
Assignee:
EXAX INC
International Classes:
C08L79/08; C08G73/10; C08K7/16; H05K1/09; H05K3/10; H05K3/12
Domestic Patent References:
| JP2003313427A | 2003-11-06 | |||
| JPH0196246A | 1989-04-14 |
Foreign References:
| WO2008016148A1 | 2008-02-07 | |||
| WO2007028462A1 | 2007-03-15 |
Attorney, Agent or Firm:
▲吉▼川 俊雄