Title:
PATTERN FORMING METHOD OF HIGH TEMPERATURE SUPERCONDUCTING FILM
Document Type and Number:
Japanese Patent JPH02192778
Kind Code:
A
Abstract:
PURPOSE:To enable easy formation and reduce deterioration by forming a plasma polymerization film on a high temperature superconducting film so as to be in close contact with each other, and further forming the plasma polymerization film while the high temperature superconducting film is protected. CONSTITUTION:On a substrate 1, a high temperature superconducting film 2 is formed, on which a plasma polymerization film 3 is formed. The substrate 1 is a flat plate composed of MgO or the like, on which the superconducting film 2 is formed by sputtering method or deposition method. The superconducting film 2 is composed of high temperature superconductor exhibiting a high transition temperature. While the superconducting film 2 is protected, the polymerization film 3 thereon is subjected to plasma processing. When fluorine compound not containing CF4 or oxygen is used as treatment gas in the plasma processing, denseness and corrosion resistance of the polymerization film 3 are increased. While the superconducting film 2 is protected by the polymerization film 3 so as to be in close contact with each other, a specified pattern is formed, and the polymerization film 3 is eliminated.
Inventors:
MOROHASHI SHINICHI
Application Number:
JP1241589A
Publication Date:
July 30, 1990
Filing Date:
January 20, 1989
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
C04B41/87; C01G1/00; C23C14/04; C23C14/06; C23C14/08; C23C16/00; C23C16/04; C23C16/30; H01B12/06; H01B13/00; H01L39/24; (IPC1-7): C04B41/87; C23C14/04; C23C14/08; C23C16/00; C23C16/04; C23C16/30; H01B12/06; H01B13/00; H01L39/24
Attorney, Agent or Firm:
Teiichi Ijiba (2 outside)