Title:
PHOTOCURABLE RESIN COMPOSITION AND METHOD FOR FORMING IRREGULAR PATTERN
Document Type and Number:
Japanese Patent JP3527651
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a photocurable composition capable of forming a coating film excellent in strengths, heat resistance, scratch resistance, water resistance, chemical resistance, and adhesion to substrates by using a urethane-modified acrylic resin, a mold release, and a urethane acrylate or a polyester acrylate as the essential components.
SOLUTION: A urethane modified acrylic resin represented by the formula is used. In the formula, five R1 s are each independently hydrogen or methyl; R2 is a 1-16C hydrocarbon group; X and Y are each a linear or branched alkylene; (l) is an integer of 20-90; (m) is an integer of 0-50; (n) is an integer of 10-80; and (o) is an integer of 0-20; provided that the sum of (l), (m), (n), and (o) is 100. The amounts of the mold release and the urethane acrylate or the polyester acrylate are each about 0.1-50 pts.wt. per 100 pts.wt. resin of the formula. It is desirable that the molecular weight of the resin of the formula is 10,000-200,000. The mold release used is a modified silicone oil, especially desirably, a reactive silicone oil.
Inventors:
Ueda, Kenji
Shioda, Satoshi
Shioda, Satoshi
Application Number:
JP3701999A
Publication Date:
May 17, 2004
Filing Date:
February 16, 1999
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
C08F299/06; C08L33/06; C08L75/04; G03H1/04; G02B5/18; (IPC1-7): C08L33/06; C08L75/04; G02B5/18; G03H1/04
Attorney, Agent or Firm:
吉田 勝広 （外１名）
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