To provide a photosensitive adhesive composition being excellent in developability, photosensitive characteristics such as adhesion to silicon, glass substrate or the like, and bond strength and being excellent in credibility of a cured film, and to provide a photosensitive element using the same, a forming method for resist pattern, and a bonding method for a member to be bonded.

A photosensitive adhesive composition includes (A) a photosensitive group-containing polybenzoxazole precursor, (B) a photopolymerizable compound having an ethylenic unsaturated group in its molecule, (C) a photopolymerization initiator, and (D) an epoxy resin.