To provide the solventless photosensitive resin composition and the resist pattern forming method superior in sensitivity and resolution, and capable of forming a stable positive resist pattern.
This photosensitive resin composition contains (A) a polymer having acid-decomposable ester groups and a weight average molecular weight of 1,000-50,000, (B) a compound having one ethylenic unsaturated bond per one molecule and a group capable of being decomposed by an acid to produce a carboxylic acid, (C) a compound generating an acid by irradiation with active energy rays, (D) a photoradical-polymerization initiator. The resist pattern is formed by irradiating the coating film of this composition with a active energy rays having the wavelength by which the initiator (D) is activated but an acid generating compound (C) is not activated to radically polymerize the compound (B) to form a tack-free film, and then, selectively irradiating the compound (C) with the active energy rays for activating the compound (C), and heating it to develop and remove the irradiated parts in alkaline aqueous solution.
SASAKI MASAKI
SAITO TERUO
Next Patent: PHOTOSENSITIVE COMPOSITION