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Title:
PIEZOELECTRIC VIBRATION DEVICE
Document Type and Number:
Japanese Patent JP2015139053
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a piezoelectric vibration device usable in a variety of applications such as VCXO, SPXO, TCXO, OCXO and on-vehicle X'tal.SOLUTION: A vibration-side first bonding pattern 251 and a vibration-side second bonding pattern 252 which are physical vapor deposited are formed on both main surfaces 211, 212 of a crystal diaphragm 2. A sealing-side first bonding pattern 321 which is physical vapor deposited is formed on a first seal member 3, and a sealing-side second joining pattern 421 which is physical vapor deposited is formed on a second seal member 4. The sealing-side first bonding pattern 321 and the vibration-side first bonding pattern 251 are diffusion-bonded, and the sealing-side second bonding pattern 421 and the vibration-side second bonding pattern 252 are diffusion-bonded. In the second seal member 4, connection terminals 431, 432 to be diffusion-bonded to a function part 7, where external electrode terminals 721, 722 directly bonded to a circuit board 61 are formed, are formed, the connection terminals being physical vapor deposited.

Inventors:
IIZUKA MINORU
KOJO TAKUYA
Application Number:
JP2014008801A
Publication Date:
July 30, 2015
Filing Date:
January 21, 2014
Export Citation:
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Assignee:
DAISHINKU CORP
International Classes:
H03H9/02; H01L23/02; H03B5/32
Domestic Patent References:
JP2012191560A2012-10-04
JP2008219206A2008-09-18
JP2012191560A2012-10-04
JP2008219206A2008-09-18
Foreign References:
WO2006104265A12006-10-05
WO2006104265A12006-10-05
Attorney, Agent or Firm:
Patent Business Corporation Ark Patent Office