Title:
PLASMA PROCESS EQUIPMENT
Document Type and Number:
Japanese Patent JPH07153822
Kind Code:
A
Abstract:
PURPOSE: To eliminate the potential difference between a wafer surface and a wafer mounting electrode during plasma irradiation, and prevent the deterioration of withstand voltage.
CONSTITUTION: A clamp ring 21 is mainly constituted of conductive material. The electric potential of the clamp ring 21 is made equal to that of an electrode on which a wafer 3 is mounted. More practically, aluminum 23 is used as the core material of the clamp ring 21, and the surface of the core material is formed of alumina 25. At least in the contact part 21a with the wafer mounting electrode 1 and the contact part 21b with the wafer surface, the aluminum 23 is exposed and electric contact is obtained.
Inventors:
HOUGEN HIROSHI
ORITA TOSHIYUKI
ORITA TOSHIYUKI
Application Number:
JP32988493A
Publication Date:
June 16, 1995
Filing Date:
November 30, 1993
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/302; H01L21/3065; H01L21/68; H01L21/683; (IPC1-7): H01L21/68; H01L21/3065
Attorney, Agent or Firm:
Kuninori Funabashi