Title:
PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2022068031
Kind Code:
A
Abstract:
To provide a plasma processing device and a plasma processing method, capable of performing homogeneous substrate processing regardless of the number of substrates that are to be processed in a plurality of processing chambers with a common exhaust space.SOLUTION: There is provided a plasma processing device including: a plurality of plasma processing chambers; a processing gas supply line to supply a gas for plasma processing to each of the plurality of plasma processing chambers; a first added gas supply line to supply an added gas to each of the plurality of plasma processing chambers; an exhaust space shared by the plurality of plasma processing chambers; and a control part. The control part executes processing for identifying a first plasma processing chamber group comprising plasma processing chambers performing plasma processing to a substrate in the plurality of plasma processing chambers and a second plasma processing chamber group comprising plasma processing chambers not performing plasma processing to a substrate in the plurality of plasma processing chambers, and executes processing for supplying the added gas from the first added gas supply line to plasma processing chambers which belong to the second plasma processing chamber group.SELECTED DRAWING: Figure 1
Inventors:
SAKAI YUZURU
TERASHIMA RYO
TERASHIMA RYO
Application Number:
JP2020176954A
Publication Date:
May 09, 2022
Filing Date:
October 21, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/3065
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito