To provide a plasma treatment equipment, capable of preventing reaching to an excitation region of dust flying up from a pressure regulating valve which is installed to an exhaust pipe or from the interior wall of the exhaust pipe.
This plasma treatment equipment has a chamber 1, which has an exhaust port 11 and the inside of which is supplied with a reactive gas, a table 2, which is installed into the chamber and in which a semiconductor wafer U is mounted on the top face, a pair of electrodes 3, 5 for exciting the reactive gas and changing it into plasma, an exhaust pump 13 having an exhaust pipe 12 connected to the exhaust port for decompressing the inside of the chamber, a pressure regulating valve 14 for regulating pressure in the chamber decompressed by the exhaust pump 13 mounted on the exhaust pipe 12, and a dust diffusion preventing member 15, which is set up between the excitation region 10 of the reactive gas by the electrodes and the exhaust port, to which the exhaust pipe 12 is connected, in a state which isolates these excitation region 10 and exhaust port, and in which vent holes 17a... are formed at places displaced from the exhaust port.
TONOYA JIYUNICHI
HANDA MASAKI
KAMIYASHIKI MASARU
IWATE TOSHIBA ELECTR0NICS KK
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