To provide a plating method by which a plating film can be reliably formed by an electroless plating method on the entire surface of an Ag electrode provided on a ceramic base material containing a Cu component and an unnecessary plating film is not deposited on a region other than the Ag electrode region on the ceramic base material.

When electroless plating is performed on the Ag electrode formed on the ceramic base material containing the Cu component, a Cu etching step for performing etching for removing the Cu component existing on the Ag electrode and in the region where the Ag electrode is not formed on the ceramic base material and an Ag etching step for performing etching for removing an Ag component existing in a region where the Ag electrode is not formed on the ceramic base material are performed and then electroless plating is performed on the Ag electrode. The Cu etching step and the Ag etching step are performed as separate steps. The Cu etching step is performed using an etching liquid in which Ag is not dissolved.