Title:
PLATINUM ALLOY PLATING BATH AND PRODUCTION OF PLATINUM ALLOY-PLATED ARTICLE USING THE BATH
Document Type and Number:
Japanese Patent JPH05271981
Kind Code:
A
Abstract:
PURPOSE:To form a platinum alloy plating film capable of being thickened and with the luster and hardness being better than those of pure platinum by using a platinum alloy plating soln. contg. at least one kind of metal ion among Sn, Zn and Pd in addition to Pt in electroplating. CONSTITUTION:A platinum alloy electroplating soln. contg. 1-100g/l of Pt as a Pt(OH)6<2-> complex ion and >=1 kind of metal ion among Sn, Zn and Pd and kept at pH >=7 and 60 deg.C is used, and electroplating is carried out with a DC or pulse current. In this case, Sn is added as sodium stannate or potassium stannate, Zn is added to form Zn(OH)3<-> or Zn(OH)4<2-> as Zn ion, Pd is added as Pd(NH3)2Cl2 to form (Pd(NH3)2)<2+>, etc., the total amt. of the additives is controlled to 50mg/l to 100g/l, and further amidosulfuric acid or its Na salt, K salt, etc., are added to obtain a plating soln. to be used.
Inventors:
Satoshi Yukida
Application Number:
JP9746192A
Publication Date:
October 19, 1993
Filing Date:
March 25, 1992
Export Citation:
Assignee:
Japan Electro Plated Engineering Co., Ltd.
International Classes:
C25D3/56; (IPC1-7): C25D3/56
Attorney, Agent or Firm:
Takeshi Takatsuki