Title:
POLISHING APPARATUS AND POLISHING METHOD USING IT
Document Type and Number:
Japanese Patent JP3489272
Kind Code:
B2
Abstract:
PURPOSE: To ensure uniform polishing the surface of a substrate and between substrates by disposing a plurality of polishing means in which distances of rotary boars from the center are different from each other, and a radius of the rotary board covers a locus drawn on the rotary board upon polishing.
CONSTITUTION: Polishing cloth 1 is sticked over a rotary board 2, and a substrate 4 of a substrate holder 5 is slidably held on the polishing cloth 1 in close contact with the same. First, second, and third polishing heads 6, 7, and 8 are disposed in order from the center of the rotary board 2 to the outer periphery of the same at a predetermined position on the upstream side of the substrate holder 5. A slurry like polishing agent 3 is supplied onto the polishing cloth 1 between the first polishing head 6 and the second polishing head 7 and between the second polishing head 7 and the third polishing head 8. The entire surface of the polishing cloth 1 is polished with the three polishing heads 6 to 8 such that a radius of the rotary board 2 covers loci T1 to T3 drawn by the bottom surface of the rotary board by the rotation of the rotary board 2. Accordingly, uniform polishing is ensured.
Inventors:
Hideharu Nakajima
Application Number:
JP15003695A
Publication Date:
January 19, 2004
Filing Date:
June 16, 1995
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/304; B24B53/017; (IPC1-7): H01L21/304; B24B37/00
Domestic Patent References:
| JP265966A | ||||
| JP6320413A | ||||
| JP6368360A |
Attorney, Agent or Firm:
Akira Koike (2 outside)
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