Title:
研磨用組成物および研磨方法
Document Type and Number:
Japanese Patent JP7074525
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing composition by which in roughly polishing a silicon wafer, an end part sagging can be reduced while keeping a high polishing rate and an object to be polished, of which the whole flatness is increased, can be provided.SOLUTION: A polishing composition is to be used for roughly polishing a silicon wafer. The polishing composition comprises: silica; a water-soluble polymer; a basic compound; and water. The water-soluble polymer consists of two or more kinds of water-soluble polymers different in adsorbability to silica.SELECTED DRAWING: None
Inventors:
Kosuke Tsuchiya
Megumi Taniguchi
Keisuke Numata
Megumi Taniguchi
Keisuke Numata
Application Number:
JP2018058698A
Publication Date:
May 24, 2022
Filing Date:
March 26, 2018
Export Citation:
Assignee:
Fujimi Incorporated Co., Ltd.
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| JP2016138278A | ||||
| JP2015109423A | ||||
| JP2016135882A | ||||
| JP2015205348A | ||||
| JP2015185672A |
Attorney, Agent or Firm:
Hatta International Patent Corporation