To provide a polishing device and a polishing method suitable for flattening the surface of the work to be processed at a controlled temperature by a chemical and mechanical polishing(CMP) method.
A fluid pressure in a first passage 13 to supply the fluid 11 to a space 14 is kept bigger than a fluid pressure in a second passage 15 to discharge the fluid from the space 14 by using a polishing tool 100 having the space 14 formed so as to make contact with a polishing pad 1 through an elastic body 2 in a polishing pad holder 5. The flow of the fluid is produced in the space 14 and the fluid pressure in the space 14 is practically kept at a designated value by supplying the fluid to the space 14 and discharging it from the space 14. The polishing pad 1 is pressed onto a work by transmitting the fluid pressure in the space 14 to the polishing pad 1 through the elastic body 2, and the polishing pad 1 is moved relatively to the work while controlling the temperature of the fluid supplied to the space 14, in order to grind the work.
KANESHIMA KEINOSUKE
SHINGU KATSUKI
