Title:
POLISHING DEVICE AND POLISHING PAD
Document Type and Number:
Japanese Patent JP2013010169
Kind Code:
A
Abstract:
To effectively polish a substrate with a simple constitution.
In a CMP device 1, a thin film 4 is attached to a platen 2 and the polishing pad 5 is fixed so as to cover the thin film 4. A step 5A of the polishing pad 5 is formed above the platen 2 because the outer diameter of the thin film 4 is smaller than the outer diameter of the polishing pad 5. A polishing head 10 holding the substrate 6 is rotatably and reciprocatingly arranged above the polishing pad 5. The substrate 6 is pushed to the step 5A when polishing the substrate 6. The distance from the platen 2 to the upper surface of the polishing pad 5 is adjusted in by the thin film 4, thereby a polishing rate is controlled.
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Inventors:
SHIRASU TETSUYA
Application Number:
JP2011145637A
Publication Date:
January 17, 2013
Filing Date:
June 30, 2011
Export Citation:
Assignee:
FUJITSU SEMICONDUCTOR LTD
International Classes:
B24B37/22; H01L21/304
Domestic Patent References:
| JP2010247330A | 2010-11-04 | |||
| JPH06210563A | 1994-08-02 | |||
| JPH08243913A | 1996-09-24 | |||
| JP2011031322A | 2011-02-17 |
Attorney, Agent or Firm:
Mitsuharu Kawakami