To provide a polishing molding and a polishing surface table using the polishing molding applicable to a machining process and a CMP process for polishing a substrate material for a semiconductor substrate, an oxide monocrystal substrate, various glass substrates, a quartz glass substrate or a ceramic substrate, an optical material requiring precision machining, and the like to attain a polished material surface of high accuracy at much higher speed and to permit stable work without degrading the characteristic even in polishing.
This polishing molding formed of inorganic grains has a sliding- rubbing part and a non-sliding-rubbing part on a face concerned with polishing. Pores existing in the sliding-rubbing part have a diameter of 1 μm or less, and its area is 15-75% of the whole area of the sliding-rubbing part. Further, the area of the non-sliding-rubbing part is 20-80% of the whole area of the face concerned with polishing. The polishing surface table using such a polishing molding is used.
KONDO SATORU
ASANO MUTSUMI
| JPH11198030A | 1999-07-27 |
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