Title:
POLISHING PLATE FOR MIRROR POLISHING SILICON WAFER AND METHOD THEREOF
Document Type and Number:
Japanese Patent JP2002064071
Kind Code:
A
Abstract:
To provide a polishing plate for mirror polishing a silicon wafer which can provide an excellent polishing rate, can provide an excellent flatness to the shape of the wafer after being mirror polished, can provide an accurate shape without any edge sag at the outer peripheral part of the wafer without any scratch flaw and with a low polishing cost, and also to provide a method for mirror polishing the silicon wafer using the polishing plate.
The polishing plate for mirror polishing a silicon wafer is made of a plastic plate. In the method for mirror polishing a silicon wafer, the silicon wafer is mirror polished by a polishing device or lapping device wherein the polishing plate is fixed onto a platen.
Inventors:
KINOSHITA NOBORU
ANDO KAZUTO
YAMAMOTO YOSHITAKA
ANDO KAZUTO
YAMAMOTO YOSHITAKA
Application Number:
JP2001168508A
Publication Date:
February 28, 2002
Filing Date:
June 04, 2001
Export Citation:
Assignee:
SUMITOMO OSAKA CEMENT CO LTD
International Classes:
B24B37/20; B24B37/24; B24B37/26; H01L21/304; (IPC1-7): H01L21/304; B24B37/00
Attorney, Agent or Firm:
Tsuchihashi Aoi