To provide a polyamideimide resin compositions excellent in flexibility, adhesion to a sealant, solvent resistance, chemical resistance while retaining low warpage and, in addition, soluble in a non-nitrogen based polar solvent, having low temperature curability, and excellent in heat resistance, electrical properties, moisture resistance, workability and economical efficiency, and coating film-forming materials containing the same.
A polyamideimide resin composition contains (A) 100 pts.wt. polyamideimide resin obtained by reacting (a) a tri or higher-valent polycarboxylic acid having an acid anhydride group or its derivative, (b) a dicarboxylic acid having a number average molecular weight of 1,000-10,000 which is represented by the formula wherein a plurality of R are each independently a 1-12C alkylene group; a plurality of X are each independently a 1-12C alkylene group or an arylene group; and m and n are each independently an integer of 1-20, and (c) a polyisocyanate compound and (B) 1-50 pts.wt. epoxy resin, and coating film-forming materials contain the polyamideimide resin composition.
ONOSE KATSUHIRO
OKAWARA TOSHIICHI
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