Title:
SEMICONDUCTOR SEALING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
Japanese Patent JP2000230039
Kind Code:
A
Abstract:
To provide semiconductor sealing epoxy resin compositions excellent in storage stability and quick curability as well.
Semiconductor sealing epoxy resin compositions comprise, together with (A) an epoxy resin and (B) a phenolic resin, (C) a curing agent and (D) a curing accelerator-containing microcapsule having a core/shell structure in which the core portion is of a curing accelerator and the shell portion is of a thermoplastic resin.
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Inventors:
IKEMURA KAZUHIRO
Application Number:
JP24852399A
Publication Date:
August 22, 2000
Filing Date:
September 02, 1999
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C08G59/18; C08G59/24; H01L21/56; H01L23/29; C08G59/68; H01L23/31; (IPC1-7): C08G59/68; C08G59/24; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Nishihiko Yasuhiko
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