POLY(ARYLENE ETHER) ADHESIVE COMPOSITION

Title:

POLY(ARYLENE ETHER) ADHESIVE COMPOSITION

Document Type and Number:

Japanese Patent JP2002173659

Kind Code:

A

Abstract:

To solve such a problem that a thermoset adhesive having excellent solvent resistance, toughness, adhesive strength and coating operability (fluidity, repletion or the like) is required.

This adhesive for a thermoplastic film consists of a composition comprising a poly(arylene ether) resin, a thermosetting resin, a toughening agent, and an optional plasticizer, a cure agent, a filler, a stabilizer, an antioxidant and an lubricant. The adhesive is especially useful for the application of a wiring board.

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Inventors:

DAVIS MICHAEL JOHN
TRACY JAMES ESTEL
RIDING GEOFFREY HENRY
YEAGER GARY WILLIAM

Application Number:

JP2001184174A

Publication Date:

June 21, 2002

Filing Date:

June 19, 2001

Export Citation:

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Assignee:

GEN ELECTRIC

International Classes:

B32B15/08; B32B7/12; C08L63/00; C08L71/12; C09J129/14; C09J153/02; C09J163/00; C09J163/02; C09J163/04; C09J167/00; C09J171/10; C09J171/12; C09J179/00; C09J201/00; C08L67/00; (IPC1-7): C09J171/10; B32B15/08; C09J129/14; C09J153/02; C09J163/00; C09J163/02; C09J163/04; C09J167/00; C09J179/00; C09J201/00

Attorney, Agent or Firm:

Kenichi Matsumoto

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