Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYPROPYLENE-BASED RESIN COMPOSITION AND FOAM MOLDING
Document Type and Number:
Japanese Patent JP2006143769
Kind Code:
A
Abstract:

To provide a polypropylene-based resin composition which can provide foam moldings excellent in balance of foamability and productivity and also excellent in drawdown properties during thermoforming.

The polypropylene-based resin composition comprises (A), (B) and (C). (A): 10-50 wt% of a polyolefin component having branched structure and 5-30 g of melt tension at 230°C; (B): 20-70 wt% of a polypropylene-based resin satisfying (B-1) to (B-4): (B-1) melt tension at 190°C being 0.5-5 g, (B-2) a melt flow rate being 1-10 g/min, (B-3) the ratio of weight average molecular weight to number average molecular weight being 2-4.5, and (B-4) relaxation time (τ) at angular frequency ω=0.1 rad/s being 0.5-2.0 s in the melt viscoelasticity behavior; and (C) 20-70 wt% of a random copolymer polypropylene satisfying (C-1) and (C-2): (C-1) a melt flow rate being 1-8 g/10 min, and (C-2) ethylene unit content being 1-5 wt%.


Inventors:
UMEDA TAKASHI
KONO TAKAYUKI
KATO KOJI
TANAKA YOSHIKATSU
KISHIDA TOYOJI
Application Number:
JP2004331795A
Publication Date:
June 08, 2006
Filing Date:
November 16, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
PRIME POLYMER KK
International Classes:
C08L23/02; C08J9/04; C08L23/26
Attorney, Agent or Firm:
Kihei Watanabe