Title:
POWDER COMPACTING DIE DEVICE
Document Type and Number:
Japanese Patent JP3553729
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a powder compacting die device which raises the precision of a die and the durability and which efficiently execute hot compacting by preventing the center displacement of bearing elements of the die device and reducing the occurrence of abnormal friction.
SOLUTION: In a die device of the withdrawal process providing heaters 16, 25 to heat the die, a die plate receiving plate 26 is provided on the down face of the die plate 23 through an insulation means, a guide rod 60 is fixed on the die plate receiving plate 26, a guide post 14 is fitted to a bearing 24 of the die plate receiving plate 26 or fixed to the die plate receiving plate 26 in the state without relating to the die plate 23.
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Inventors:
Katsuhiko Ueda
Takeshi Oba
Yoshio Sasahara
Takeshi Oba
Yoshio Sasahara
Application Number:
JP9350796A
Publication Date:
August 11, 2004
Filing Date:
March 21, 1996
Export Citation:
Assignee:
Hitachi Powdered Metals Co., Ltd.
International Classes:
B30B11/02; B22F3/02; B22F3/035; (IPC1-7): B30B11/02; B22F3/035
Domestic Patent References:
| JP48088574U | ||||
| JP51157554U | ||||
| JP59104296A | ||||
| JP2020696A | ||||
| JP4210900A | ||||
| JP810994A |
Attorney, Agent or Firm:
Hajime Maejima
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