To provide a power semiconductor module which can be assembled with a high degree of precision, can meet a demand for arrangement of several modules, and can easily cope with parallel connection of a plurality of the modules.

An enclosing case 3 has a terminal holding convex part 33 on the end surface of its periphery wall, and the end part having an outer terminal 6 of a draw-out terminal 31 is extended out from the top of the terminal holding convex part. A cover 4 has an insertion hole 42 into which the terminal holding convex part is fitted, and the top of the terminal holding convex part is projected out from the insertion hole 42. Further, the respective portions are arranged so that the external terminal 6 and a fixing hole 11 superimpose each other in viewing a direction perpendicular to the longitudinal direction of a heatsink 1, and in a result, the size is reduced. Furthermore, two external terminals 6a, 6b for a P pole and an N pole are not arranged corresponding to AC input external terminals 6c, 6d, 6e arranged in a line, and wiring bars 7, 7, 7 in a line shape can be connected between the AC input external terminals 6c, between the AC input external terminals 6d, and between the AC input external terminals 6e respectively in parallel.