Title:
SEMICONDUCTOR PACKAGE AND DISPLAY DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2008091790
Kind Code:
A
Abstract:
To provide a tape carrier type semiconductor package which allows connection terminals and wiring to be arranged without making an interposer board enlarged more than necessary when an input and an output of an IC chip are different from each other in terminal number, and to provide a display device using the same.
A semiconductor chip 2 is connected to a film board 4 via an interposer board 3 in the semiconductor package. The semiconductor chip has a plurality of terminals 6 and a plurality of terminals 7 on respective two sides facing each other. Furthermore, the semiconductor chip is shifted to one with less terminals of the two sides from the center of the interposer board and connected to the interposer board.
More Like This:
Inventors:
KATO TATSUYA
KUDOSE SATOSHI
NAKAGAWA TOMOKATSU
TSUKAO TOSHIYA
KUDOSE SATOSHI
NAKAGAWA TOMOKATSU
TSUKAO TOSHIYA
Application Number:
JP2006273306A
Publication Date:
April 17, 2008
Filing Date:
October 04, 2006
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L23/12; G02F1/1345; H01L21/60; H01L23/14
Domestic Patent References:
| JP2006023469A | 2006-01-26 | |||
| JP2004207566A | 2004-07-22 | |||
| JPH11135555A | 1999-05-21 |
Foreign References:
| WO1996021948A1 | 1996-07-18 |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office