Title:
PREPREG
Document Type and Number:
Japanese Patent JP2004043690
Kind Code:
A
Abstract:
To provide a prepreg capable of obtaining a printed circuit board excellent in uniformity and dimensional stability, etc.
The prepreg is formed by applying heat-calendering treatment and water current interlacing treatment to a woven fabric composed of monofilament yarn of a liquid crystalline aromatic polyester fiber and adding a thermosetting resin composition thereto.
More Like This:
Inventors:
AIZAWA WAKANA
HYODO KENJI
HYODO KENJI
Application Number:
JP2002205008A
Publication Date:
February 12, 2004
Filing Date:
July 15, 2002
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
C08J5/24; (IPC1-7): C08J5/24