Title:
PRESSURE JOINTING DEVICE
Document Type and Number:
Japanese Patent JP2001210675
Kind Code:
A
Abstract:
To greatly improve reliability in connection of an IC chip by surely preventing deformation of a board, even if the thickness of the board becomes small.
A pressure jointing table 3 is made of metallic material having high thermal conductivity. A heat insulating material 4, made of material having low heat conductivity, is provided at a position corresponding to the mounting position of the IC ship 2 at the pressure jointing table 3. A warming heater 5 for heating the pressure jointing table 3 is provided inside the pressure jointing table 3.
Inventors:
HIDA YASUHIRO
KACHI YOSHIHARU
KACHI YOSHIHARU
Application Number:
JP2000019950A
Publication Date:
August 03, 2001
Filing Date:
January 28, 2000
Export Citation:
Assignee:
OPTREX KK
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Shunsuke Nakao (2 outside)
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