Title:
TAB TAPE CARRIER AND MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2001210677
Kind Code:
A
Abstract:
To provide a TAB tape carrier with a structure for preventing the generation of needle crystals of tin plating during plating reaction.
A first tin plating layer 11, having a thickness of 0.3 μm or smaller, is provided on a lead 3 in an electroless plating method. A second tin plating layer 12, having a thickness of 0.3 μm or smaller is provided thereon in an electroless plating method. In this case, the total thickness of tin plating is set at 0.4 to 0.6 μm.
Inventors:
MATSUMOTO YUKO
Application Number:
JP2000018041A
Publication Date:
August 03, 2001
Filing Date:
January 25, 2000
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
H01L21/60; (IPC1-7): H01L21/60