To provide a tape carrier having good advantages, such as superior wire bonding characteristics, even when it is produced as a thin plating product, and a superior soldering characteristic of solder balls even after heat treatment.

In a tape carrier, a nickel plating layer 4 as a base layer is formed on the conductive pattern of a copper foil 3 formed on a polyimide resin film 1, and a gold-plating layer 6 as an upper layer of the nickel base layer is provided. An intermediate layer, comprising one or more alloy plating layers among nickel - iron alloy plating, nickel - cobalt - iron alloy plating, and nickel - iron - phosphorous alloy plating is provided.