To provide a manufacturing method of a film carrier tape and a plating apparatus for preventing hollow space of a copper foil at an edge of a solder resist or an adhesive.

The plating apparatus 44 is composed of a first plating bath container 46, a second plating bath container 48, and a carriage path 54. The temperature of a plating solution 60 in the first plating container 46 is made lower than that of the second plating container 48. The carriage path 54 includes sprockets for carrying a film carrier tape 20. Since deposition amount is small in the first bath container 48 in the plating apparatus 44, a plating layer can be formed uniformly on the surface of the exposed part. When the film carrier tape 20 is injected into the second plating container 48 after the plating layer is formed, a new plating layer is formed on the plating layer, so that a uniform plating layer having sufficient thickness can be formed at the exposed part.