Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE TAPE USING THE SAME
Document Type and Number:
Japanese Patent JP2013067728
Kind Code:
A
Abstract:
To provide a pressure-sensitive adhesive that has adhesion at normal temperature, can be adhered to an adherend with a light pressure, and has high heat resistance.
A pressure-sensitive adhesive composition includes: a polyimidesiloxane that consists of an aromatic tetracarboxylic acid component and a diaminopolysiloxane component; and an organic peroxide. A pressure-sensitive adhesive tape has an adhesive layer that uses the pressure-sensitive adhesive composition.
Inventors:
HASHIGUCHI SHUICHI
WATAKABE HIDEJI
AOKI FUMIO
OZAWA HIDEO
WATAKABE HIDEJI
AOKI FUMIO
OZAWA HIDEO
Application Number:
JP2011207586A
Publication Date:
April 18, 2013
Filing Date:
September 22, 2011
Export Citation:
Assignee:
UBE INDUSTRIES
International Classes:
C09J183/10; C08G73/10; C09J7/02; C09J179/08