PRESSURE SENSOR MODULE AND MANUFACTURE THEREOF

Title:

PRESSURE SENSOR MODULE AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JPH10197378

Kind Code:

A

Abstract:

To provide a pressure sensor module in which an integrated circuit device can be adjusted easily.

A connector body 7a is provided with a passage 7h for leading out a part of a plurality of adjustment wiring patterns of a flexible board 13 from the joint 7f of a connector body 7. An extension 13C of the flexible board 13 is led out through the lead-out passage 7h and an integrated circuit device 23 is adjusted using a plurality of adjustment wiring patterns formed thereat. The extension 13C of the flexible board 13 is then cut off in a resin sump 7i. Subsequently, the resin sump 7i is filled with an insulating resin R and the remaining part of the extension 13C of flexible board 13 is covered with resin along with the opening of the lead-out passage.

Inventors:

ISHIKAWA HIDETO
NAKAO SATOSHI
HAYASHI KAZUTAKA

Application Number:

JP35146196A

Publication Date:

July 31, 1998

Filing Date:

December 27, 1996

Export Citation:

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Assignee:

HOKURIKU ELECT IND

International Classes:

G01L9/12; G01L19/14; (IPC1-7): G01L19/14; G01L9/12

Attorney, Agent or Firm:

Hidetoshi Matsumoto (1 outside)

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