SEMICONDUCTOR SENSOR - MITSUBISHI ELECTRIC CORP

Title:

SEMICONDUCTOR SENSOR

Document Type and Number:

Japanese Patent JPH10197374

Kind Code:

A

Abstract:

To provide a semiconductor sensor having good temperature characteristics in which pressure or acceleration detection characteristics can be prevented from deteriorating due to variation of the ambient temperature.

The semiconductor sensor comprises a semiconductor sensor chip 1 disposed substantially in the center of a die pad 3 and converting a detected pressure or acceleration into an electric signal, and a resin mold 5 covering the semiconductor sensor chip. A butter ring 6 is disposed on the die pad 3 while surrounding the semiconductor sensor chip 1.

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Inventors:

OTANI HIROSHI
YAMAGUCHI YASUO
TOMIOKA MASANORI

Application Number:

JP445797A

Publication Date:

July 31, 1998

Filing Date:

January 14, 1997

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

G01P21/00; G01L9/00; G01L9/04; G01L19/04; G01P1/00; G01P1/02; G01P15/12; (IPC1-7): G01L19/04; G01L9/04; G01P15/12; G01P21/00

Attorney, Agent or Firm:

Aoyama Ryo (2 outside people)

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