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Patent Searching and Data


Title:
PRESSURE SENSOR MODULE
Document Type and Number:
Japanese Patent JPH10197379
Kind Code:
A
Abstract:

To provide a pressure sensor module in which through capacitors provided for a plurality of terminal members can be grounded through a simple structure.

The pressure sensor module comprises a through capacitor unit 15 where through capacitors 27a-27c to be fitted with one end of terminal members 8a-8c are supported by a conductive supporting member 29 and the earth electrodes of the through capacitors 27a-27c are connected electrically with the conductive supporting member 29. The conductive supporting member 29 for the through capacitor unit 15 is provided with a pair of resilient contact members 31, 31. An opening for allowing the contacts of contact members 31, 31 to come into contact with an annular support 9 is made in the circumferential wall at the base of a connector body 7a. The contact members 31, 31 are constructed such that the contacts thereof are pressed against the inner circumferential surface of the annular support 9 through a spring force under a state where the annular support 9 is fitted over the base of the connector body 7a.


Inventors:
ISHIKAWA HIDETO
NAKAO SATOSHI
TAKAGI SHIGEKIMI
HAYASHI KAZUTAKA
Application Number:
JP35146296A
Publication Date:
July 31, 1998
Filing Date:
December 27, 1996
Export Citation:
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Assignee:
HOKURIKU ELECT IND
International Classes:
G01L9/12; G01L19/14; (IPC1-7): G01L19/14; G01L9/12
Attorney, Agent or Firm:
Hidetoshi Matsumoto (1 outside)