PURPOSE: To enhance the bonding strength of the plating nuclei and plating metal to be adhered after formation of prescribed patterns by bringing a colloidal dispersion of Pd-Sn particles into contact with a substrate surface subjected to surface roughening, then activating this surface, laminating a photosensitive compsn. thereon and exposing this compsn., thereby forming the patterns.
CONSTITUTION: The surface of the nonconductive substrate is roughened and is brought into contact with the uniform colloidal dispersion of the Pd-Sn particles having a grain size of 10 to 50. The surface is then brought into contact with about 0.05 to 1mol alkaline hydroxide soln. to form the layer of the activated Pd-Sn particles. The photosensitive compsn. is laminated on such surface and is exposed and developed to the prescribed patterns, by which the prescribed patterns are formed on the substrate. The metals are selectively bonded with the good bonding strength to the nonconductive substrate by such pretreatment. This method is suitable for production of printed circuit cards and printed circuit boards.
UIRIAMU HOOUERU ROORENSU
GARII KEBIN REMON
ROI HAABUEI MAGUNESON
BOYA RISUTA MAKOBUITSUCHI
RARUFU ERIOTSUTO PAASONZU
KAAROSU JIYUUN SANBUSETSUTEI
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