Title:
PRETREATMENT FOR PLATING LEAD FRAME
Document Type and Number:
Japanese Patent JP2000129488
Kind Code:
A
Abstract:
To provide a pretreatment for plating a lead frame by which the smut generated on the surface of the lead frame is completely and uniformly removed by pickling without deforming the lead part, thereby preventing defective plating perfectly.
(1) After a copper-alloy lead frame is pickled, the frame before plating is dipped in a liq. of a temp. ≥20°C lower than that of the pickling soln. (2) After the copper-alloy lead frame is pickled, the frame before plating is dipped in a liq. of a temp. ≥20°C lower than that of the plating soln. and then dipped in another liq. of a temp. ≥20°C higher than that of the first liq.
Inventors:
KODAIRA MUNEO
OZAKI TOSHINORI
OZAKI TOSHINORI
Application Number:
JP30872998A
Publication Date:
May 09, 2000
Filing Date:
October 29, 1998
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
H01L23/50; C25D5/34; (IPC1-7): C25D5/34; H01L23/50
Attorney, Agent or Firm:
Takashi Matsumoto