Title:
Printed circuit board
Document Type and Number:
Japanese Patent JP5934057
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing the same which are capable of forming a fine pitch and a solder ball which are taller than the prior art and increase design flexibility.SOLUTION: A printed circuit board 100 comprises: a base substrate 110 having a connection pad 120; a solder resist layer 130 having a first opening on the connection pad 120; and a solder ball 160 formed in the first opening, where the solder ball 160 has a shape of a snowman.
Inventors:
Li, San Yun
Yun, Kyonro
Yong, Gwangsob
Yun, Kyonro
Yong, Gwangsob
Application Number:
JP2012183257A
Publication Date:
June 15, 2016
Filing Date:
August 22, 2012
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H05K3/34; H05K1/18
Domestic Patent References:
| JP2007214332A | ||||
| JP2006049791A |
Foreign References:
| KR1020100020820A |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike
Koji Kikawa
Hiroyuki Sato
Shigeru Koike
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