Title:
PRINTED WIRING BOARD DEVICE
Document Type and Number:
Japanese Patent JPH01179398
Kind Code:
A
Abstract:
PURPOSE:To lower a junction temperature and to improve both longlivedness and reliability, by a structure wherein a high thermal conductive cooling plate is disposed between a base board of a high exothermic package and a printed wiring board, and a cooling fin is disposed on the exposed section of the cooling plate. CONSTITUTION:A plurality of high exothermic packages 13 in each of which a sealing metal cap 15 is mounted on a base board 14 are disposed on a printed wiring board 11. And, a cooling plate 16 made of a high thermal conductive metal, such as aluminium or the like, is disposed between the base board 14 and the printed wiring board 11. Now, this cooling plate 16 has an outer diameter of substantially the same size as that of the printed wiring board 11 and is provided with through holes 17 through which input/output terminals 12 are to be inserted. And, the input/output terminals 12 are connected with through holes 18 of the printed wiring board 11 through the through holes 17. Further, a cooling fin 19 made of a high thermal conductive metal or the like, such as aluminium or the like, is disposed on the exposed section of the cooling plate 16 located between the high exothermic packages 13. In the present printed wiring board device, cooling is performed by both the cooling plate 16 and the cooling fin 19.
Inventors:
FUKUOKA YOSHITAKA
Application Number:
JP33245587A
Publication Date:
July 17, 1989
Filing Date:
December 30, 1987
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H05K7/20; H05K1/02; H05K1/05; H05K1/18; (IPC1-7): H05K7/20
Attorney, Agent or Firm:
Saichi Suyama