Title:
PRINTED WIRING BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP2738203
Kind Code:
B2
Abstract:
PURPOSE: To form a solder resist layer with a fine width between component pads with a high accuracy regardless of expansion and contraction in a manufacturing process.
CONSTITUTION: After a space between conductor patterns 3 is filled with first solder resist 4 by a means for filling a space between conductors with solder resist which is removed by a squeegee, etching resist 2 is removed to expose conductors 3-1. Among the conductors 3-1, those which are not component pads 6, etc., are coated with second solder resist 7 by printed.
Inventors:
KIKUCHI HIDEO
SHIMOZU TAKESHI
SHIMOZU TAKESHI
Application Number:
JP6443492A
Publication Date:
April 08, 1998
Filing Date:
March 23, 1992
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H05K3/06; H05K3/28; (IPC1-7): H05K3/28
Domestic Patent References:
| JP63169792A | ||||
| JP290697A | ||||
| JP290698A | ||||
| JP6072294A | ||||
| JP6464292A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
Previous Patent: INTAKE CONTROL DEVICE FOR INTERNAL COMBUSTION ENGINE
Next Patent: SQUARE-LAW CIRCUIT
Next Patent: SQUARE-LAW CIRCUIT